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Re: gEDA: QFP footprint naming conventions

To: geda-dev@seul.org
Subject: Re: gEDA: *QFP* footprint naming conventions
From: "Charles Lepple" <clepple@ghz.cc>
Date: Fri, 29 Aug 2003 12:28:06 -0400 (EDT)
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Wojciech Kazubski said:

> Another question: Some QFPs have a heatsink on the bottom side that has to
> be soldered to the board. Do they need a separate footprint (heatsinks can
> have different size) or can the heatsink pad be added manually as copper
> zone?

I haven't tried this in the latest version of pcb, but to add the copper
separately, you would need copper without soldermask. I vaguely recall
running into a limitation in pcb-1.6.3 regarding this, but I could be
wrong.

-- 
Charles Lepple <clepple@ghz.cc>
http://www.ghz.cc/charles/

References:
- Re: gEDA: *QFP* footprint naming conventions
  - From: Larry Doolittle <ldoolitt@recycle.lbl.gov>
- Re: gEDA: *QFP* footprint naming conventions
  - From: Wojciech Kazubski <wk@ire.pw.edu.pl>

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