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Re: gEDA-user: Design Flow Roadmap starting point
On 3/18/07, C P Tarun <tcpip@xxxxxxxxxxxxxxxx> wrote:
> You may want to try one of the many footprint scripts that are around.
> Making the footprints in a batch using a script is a lot less error prone
> than one by one in the GUI.
>
> If you are looking for DIPs or SIP headers with rounded pads over pins
> you could try my website.
Actually I've seen some of those scripts and they are lovely for the kind
of things they do. But I need to build much simpler footprints like TO220
devices, but with elongated pads. These are best done by hand, I guess.
I even like TO92 to have elongated pads. I suspect I'm just unsure of my
soldering skills and like larger pads, that's all. :)
A script to place TO220 pads can be pretty simple (see below). The
poorly named routine element_add_pin_oval overlays a pin, a rounded pad
on the component side and a rounded pad on the solder side.
Adding a simple silkscreen would be one or two more lines of code.
(* jcl *)
use strict;
use warnings;
use Pcb_8;
my $Pcb = Pcb_8 -> new(debug => 1);
$Pcb -> element_begin(description => 'TH',
output_file =>
"tmp/" . 'TO220',
dim => 'mils');
my $pin_num = 1;
my @pos = (-100, 0, 0, 0, 100, 0);
while (@pos) {
my ($x, $y) = splice @pos, 0, 2;
$Pcb -> element_add_pin_oval(x => $x,
y => $y,
width => 80,
length => 66,
name => '',
pin_number => $pin_num++,
clearance => 10,
drill_hole => 46,
mask => 10);
}
$Pcb -> element_output();
--
http://www.luciani.org
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