[Author Prev][Author Next][Thread Prev][Thread Next][Author Index][Thread Index]

gEDA-user: Problems with a TDSON8 footprint



   I am using an Infineon power mosfet in a voltage converter.  I'm
   attaching the datasheet.  Pins 5 thru 8 get tied together and the
   actual footprint has a big pad that ties them together.  I'm attaching
   the footprint that I made also.  I'm having trouble with PCB making the
   big pad orange when I optimize rats.  The big pad lays across each pad
   for each pin.
   How can I do this?  Suggestions?  Or, since only the big pad that lays
   across the pads for each pin turns orange, should I just ignore this?
   Thanks

Attachment: BSC120N03MSG_rev1.17.pdf
Description: Adobe PDF document

Attachment: TDSON8-1.fp
Description: application/pcb-footprint


_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user