Re: gEDA-user: "soldermask via caps"

[Dietmar Schmunkamp <dietmar@xxxxxxxxxxxxxxx>]

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Am 21.05.2010 23:46, schrieb Stefan Salewski:

> 
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Stefan,

I fear we go off-topic here, nevertheless I think it's an interesting
topic how to solder ICs with an exposed pad with homebrew equipment.
Basically there is a contradiction to create a footprint with an exposed
pad for reflow soldering and manual soldering. Manual soldering requires
a via hole of a decent size that sucks all the solder when doing reflow
soldering.

> Soldering a few outer pad of the device to fix it is not really
> good, because so I can not check if the center thermal pad is really
> soldered.

This was my very first try before using too much soldr paste --- I had
soldered some outer pins and tried to solder the exposed pad from the
reverse side (the IC on the bottom side, and IC fell off the board, so
my next try was to use too much paste.....

And as a hobbyist for me every board is a prototype :-) .

- -- 

Mit freundlichen Gruessen / Best regards

Dietmar Schmunkamp
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