gEDA-user: Problem breaking apart an element in the buffer

[tj <999alfred@xxxxxxxxxxx>]

In my continuing learning experience with creating/modifying  footprints 
I have run into the following problem. Using the inputs form several 
other users I created my first footprint, a 16 pin DIP with oval pads 
(thanks to all). Then I wanted to create 8, 14, 18, etc pins footprints. 
I selected my 16 pin footprint into the buffer and selected the "break 
buffer elements to pieces" like the manual said. I ended up with my 
original vias (pins), component side lines (pads) and silk screen, but 
NO solder side lines (pads). Why did the solder side disappear when 
executing the "break buffer elements to pieces" command?

Jeff
wd4nmq



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