gEDA-user: "Concerns in Cleaning Under Low Profile Components at SMTAI 2010"

[Bob Paddock <graceindustries@xxxxxxxxx>]

Anyone here going to this event?:

http://www.globalsmt.net/smt/index.php?option=com_content&view=article&id=11580&Itemid=396

See Kyzen’s Rich Brooks Discuss "Concerns in Cleaning Under Low
Profile Components at SMTAI 2010"

SMTA International, scheduled to take place October 25-28, 2010 at the
Walt Disney World.

Would like to know what Mr. Brooks has to say.

"The complete cleaning and removal of flux/soil residues under low
profile components is becoming more critical, especially as the
conductor spacings are decreasing and the power is increasing. If the
residues are not completely removed, then the reliability of the
circuit can be greatly affected. It is the combination of these
technologies that make the cleaning process extremely difficult.
Therefore, the cleaning process must be carefully examined and
optimized to obtain maximum performance for removing the flux
residues.

During the cleaning process, the cleaning chemistry must wet,
dissolve, penetrate the flux dam and flow under the component to
adequately remove all flux residues. This paper will review the
cleaning problems brought about with the implementation of the latest
technologies and explain how the cleaning process can be optimized to
guarantee the reliability of the assemblies."


Cleaning under QFN, and like, packages is still an industry wide
problem, especially when you are running off batteries and need low
leakage currents.


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