Re: gEDA-user: Tin pest

[Karel Kulhavy <clock@xxxxxxxxxxxxx>]

On Tue, Jan 31, 2006 at 02:26:37PM -0500, Marvin Dickens wrote:
> Karel Kulhavy wrote:
> >It looks like lead free solder may disintegrate after 1.5 year when
> >exposed to cold weather. This may be serious issue with electronics
> >stored or used outdoor in winter.
> >
> >http://materials.open.ac.uk/srg/srg_tp.htm
> >http://www.indium.com/drlasky/files/TinPestPaper0723Final.pdf
> >http://ap.pennnet.com/Articles/Article_Display.cfm?Section=Articles&Subsection=Display&ARTICLE_ID=216209
> >http://www.smartgroup.org/pdf/tinpest.pdf
> >http://www.semiconfareast.com/pbfree.htm
> >
> >Anyone has first-hand experience or can comment competently on the
> >issue?
> >  
> All of the lead free solder that we are purchasing is sold in the form 
> of alloys. Specificially,
> tin/bisthmuth and/or tin/silver. Both of these alloys are not 

Where do you get tin/bismuth? I didn't find it at my local supplier
Distrelec (distrelec.ch).

> susceptable to tin pests. In fact,

The scientific papers state that silver prevents pest very little and
doesn't prevent in the low percentages that are present in tin/silver
solder. Why do you assert tin/silver is not susceptible to tin pest?

CL<