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gEDA-user: Solder mask clearances for SMD devices
Can anybody point me to guidelines for the solder mask clearances used
for SMD devices? I haven't been able to find it mentioned in device
spec sheets or in the manufacturer capability specs from places like
batchPCB.com, PCBexpress, etc... From what I have read, it seems like
'a few thou' is good. Just to be sure, this is a few thou between the
edge of the pad/pin and the solder mask? Does anybody with experience
have a good recommended value that they know works well for devices
that have pads with 35 thou (0.035") between the edges of the pad?
I was thinking of going with 3 thou (0.003") for my solder mask.
Thanks a bunch!
~Luke
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