Re: gEDA-user: gold plating layer

[Stephen Meier <smeier@xxxxxxxxxxxxxxxxxxx>]

The surface finish is usually applied to copper areas not protected by 
soldermask. However for Gold there are two diffrent mthods. Imersion 
Gold and electro plated. Electro-plating gold (which can be done 
selectevly) is normally used for the fingers of edge connectors. I agree 
that you normally instruct the fab shop to applie electro-pated gold to 
specific locations in the fab notes.

Always always? talk to your fab shop about these kinds of processes.

Steve Meier

Stuart Brorson wrote:

> Any gold plating is usually done directly on top the copper layer.  It
> is called out on the assembly drawing as part of the specification of
> the copper layer.
>
> I have never seen a separate gold plate layer in a PCB layout
> program.  Has anybody else?  Are there situations where you wouldn't
> plate certain areas of surface copper (if you are plating)?  Can PCB
> fabs even selectively plate gold onto certain areas of the board? 
>
> Stuart
>
>
>  
>
> > Hello
> >
> > When we are already talking about various extra layers, does a gold plating
> > layer makes sense? How is the gold plating being portably specified?
> >
> > Cl<
> >
> >    
>
>
>