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Re: gEDA-user: PCB suggestion

To: geda-user@xxxxxxxx
Subject: Re: gEDA-user: PCB suggestion
From: Bob Paddock <bpaddock@xxxxxxxxxxxx>
Date: Fri, 7 Jan 2005 05:58:10 -0500
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On Friday 07 January 2005 01:57 am, Stephen Meier wrote:
> I feal like I have to step in here. With a 900 pin BGA (30 rows by 30
> columns) at a 1mm (39 mil) pitch. Four signal layers are just bearly
> able to route all the signals out from under the bga. That was using via
> in pad and squeezing two 4 mil traces between pads/layer. 

I know you can not post the design, but could you post the section relevant to 
the BGA?  I'd like to know how to do these large BGA's myself.

Via "via in pad" does that mean each ball falls into a via, or are the balls 
on non-hole pads?

Follow-Ups:
- Re: gEDA-user: PCB suggestion
  - From: Karel Kulhavy
- Re: gEDA-user: PCB suggestion
  - From: Stephen Meier

References:
- gEDA-user: PCB suggestion
  - From: Karel Kulhavy
- Re: gEDA-user: PCB suggestion
  - From: harry eaton
- Re: gEDA-user: PCB suggestion
  - From: Stephen Meier

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