Re: gEDA-user: Test pads in PCB

[John Sheahan <jrsheahan@xxxxxxxxxxxxxxxx>]

Stuart Brorson wrote:

> One clue:  When I stress or flex a failing board in the test system, I
> can often make it work (until I release the board).  This suggests
> cracked vias, ripped internal traces, or SMT passives with
> microcracks.  All of these are hard to find visually.  However, if the
> original designer had testpadded the board, we'd be able to reject
> these boards at the assembler.  
>
> Stuart

Stuart, surely both cracked vias or torn internal traces are the sorts 
of things best tested by access to all pads.
I'd suggest running several blank boards through the soldering process 
then repeating bare-board test.   This can help isolate the board faults 
due to thermal stress.
john