Re: gEDA-user: Tin pest

[Marvin Dickens <marvindickens@xxxxxxxxxxxxx>]

Karel Kulhavy wrote:
> It looks like lead free solder may disintegrate after 1.5 year when
> exposed to cold weather. This may be serious issue with electronics
> stored or used outdoor in winter.
>
> http://materials.open.ac.uk/srg/srg_tp.htm
> http://www.indium.com/drlasky/files/TinPestPaper0723Final.pdf
> http://ap.pennnet.com/Articles/Article_Display.cfm?Section=Articles&Subsection=Display&ARTICLE_ID=216209
> http://www.smartgroup.org/pdf/tinpest.pdf
> http://www.semiconfareast.com/pbfree.htm
>
> Anyone has first-hand experience or can comment competently on the
> issue?
>   
All of the lead free solder that we are purchasing is sold in the form 
of alloys. Specificially,
tin/bisthmuth and/or tin/silver. Both of these alloys are not 
susceptable to tin pests. In fact,
reputable makers/vendors of metal products are well aware of the 
propensity of the crystaline
structure of tin to physically change as a function of temperature.


Best

Marvin