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Re: gEDA-user: Footprint with thermal paddle
On Thu, Jan 8, 2009 at 6:48 PM, Eric Brombaugh <ebrombaugh1@xxxxxxx> wrote:
> Hi,
>
> I'm using a high-power TSSOP24 that needs a thermal paddle under it. The
> unusual thing about this is that the recommended solder mask on the
> paddle has less clearance in the X direction than in the Y direction.
> How would one do this in PCB?
I wonder if a couple of overlapping pads would work.
(* jcl *)
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