gEDA-user: Footprint with thermal paddle

[Eric Brombaugh <ebrombaugh1@xxxxxxx>]

Hi,

I'm using a high-power TSSOP24 that needs a thermal paddle under it. The 
unusual thing about this is that the recommended solder mask on the 
paddle has less clearance in the X direction than in the Y direction. 
How would one do this in PCB?

MFG dimensions for the pad are 3.4 x 7.8 mm, while the mask opening is 
supposed to be 2.4 x 4.48 mm.

I came up with this pad specification:

Pad[ 0 -8660
      0 8660
      13385 1000 9448 "25" "25" 0x00000100]

which has the proper amount of copper, but allows the mask opening to be 
taller than it's supposed to be.

Thanks for any insight,

Eric


_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user