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Re: gEDA-user: Thermals on Pads



On Sun, Jan 30, 2011 at 04:37:17PM -0500, rickman wrote:
> What geometry problems do you have?  There are plenty of references in 
> regard to thermals.  I don't recall seeing any other than bridges that 
> span a uniform gap around the pad.  The only variation I can recall is 
> the number and rotation angle of the pattern.   But most, if not all 
> that I have seen use four bars either along the x and y axes or at 45 
> degree angles.  I think there are even some built in commands for this 
> in the RS-274X Gerber file spec.
> 
> Or am I missing something?

We already do support bridges with rounded corners. And what we
do not support is anything suitable for TSOP package pads(long thin pads
near to each other).

But the big problem with you current implementations is the size of the
bridges. The size is somewhat magicaly calculated from the size of pin
and from the size of clerance. But this is neighter working nor probably
right.

With big clerance the shape becomes completly bogus(at least for the
rounded versions).

	Martin Kupec



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