Dan,
Let's start by assuming you can tolerate a tiny annular ring on the top
side. If so, then make the pins have a miniscule annular ring and place SMD
pads over them on the back side; use identical pin numbers for the pads and
pins that are coincident.
If you can't tolerate plated holes, then simply make SMD pads on the back
side and make pure "mounting" holes for the pins to feed through.
Either of these is fully supported with the current pcb code. Eventually we
could have the pin annular ring have per-layer size.
h.
----- Original Message -----
From: "Dan McMahill" <dan@xxxxxxxxxxxx>
To: <geda-user@xxxxxxxx>
Sent: Sunday, July 24, 2005 10:17 PM
Subject: gEDA-user: bottom side pad only in PCB
anyone ever have to deal with a part which is leaded but only wants a
solderside pad in PCB? I think it just doesn't do it currently. Anyone
have a workaround until I can get time to fix this?
Thanks
-Dan
p.s. Think metal package parts...