|
SparkFun has some good material for learning some basic SMT
techniques: http://www.sparkfun.com/commerce/hdr.php?p=tutorials See about 1/2 down, “Surface mount soldering tutorials.” Personally I go one of two routes: (1) reasonably fine-tipped temperature-regulated soldering iron,
the smallest diameter solder I could find on Mouser, and solder wick. Good part
removal is virtually impossible with this setup. (2) hot air rework station, solder paste for initial part
placing and part removal. Fine-tipped temperature-regulated soldering iron,
small diameter solder, and solder wick as well for touch-up. There’s lots of other inexpensive techniques as well but that’s
what I’ve used so far with decent results. The nice thing about #2 vs. other
reflow techniques (i.e. oven, hot plate) is that you can slowly build and test
parts of the board without having to reheat the entire board. Oven/hot plate
is better though once you have finished testing initial prototype and want to
build a larger number of boards – I just haven’t done that yet. It’s not that hard once you get the technique down. --James From: geda-user-bounces@xxxxxxxxxxxxxx
[mailto:geda-user-bounces@xxxxxxxxxxxxxx] On Behalf Of Robert Butts I'm about to
start bread boarding a desin. I have a few surface mount chips that I got SMT-to-DIP
adapters for.
I also purchased SMT paste. I have never worked with surface mount
devices.
How do you paste the chip to its footprint? How do you get the excess, if
any, paste out? I have
a feeling it's got something to do with heating it. Thanks, Rob |
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