Re: gEDA-user: Handling odd solder paste shapes

[Dave N6NZ <n6nz@xxxxxxxx>]

John Luciani wrote:
> On Thu, Jun 25, 2009 at 12:24 PM, DJ Delorie<dj@xxxxxxxxxxx> wrote:
> 
>> Me, I have a perl script that post-processes that layer to adjust the
>> sizes for the paste I want.
> 
> I was thinking of doing a Perl script that would substitute stencil
> footprints (.sfp) if they were found. Otherwise a generic adjustment
> would be made.
> 
> (* jcl *)
> 
I've thought about this problem off-and-on but never sat down to code up 
a patch.  My latest thinking is to extend the footprint definition with 
an optional "paste" command along the lines of:

paste("material", x1, y1, x2, y2, picoliters);

Which says: Apply a stripe of <material> from x1, y1 to x2, y2, with 
total volume of <picoliters>.  This handles solder paste, mounting 
adhesive, potting epoxy, etc -- my assumption that each material would 
be exported in its own layer since it is applied at a different 
processing step.  If you need a blob instead of a strip, simply set 
x1==x2, y1==y2.  It is specified in terms of volume instead of a pad 
shape since for a stencil, the size of the aperture would depend on 
stencil thickness and stencil fabrication process.  So you would convert 
volumetric output to gerber via some magic script tuned to your process, 
presumably.  Or you might use volume/x/y data directly to feed one of 
the smaller systems designed for prototyping that deposits solder using 
a syringe on an X/Y mechanism.

-dave



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