gEDA-user: Handling odd solder paste shapes

[Scott Post <scott.e.post@xxxxxxxxx>]

   I'm evaluating various layout packages to replace the commercial
   package I'm currently using.  I've been playing with gEDA/PCB for a
   couple days and reading the documentation and I'm unclear if it can
   handle solder paste layer shapes that are dissimilar to the pads.  For
   example, IPC recommends "home plate" shaped polygons for solder paste
   apertures for chip components to reduce solder balling during reflow.
   Somewhat complicated patterns are also used for printing paste for
   through hole reflow components (pin-in-paste).
   It doesn't look to me like the file structure for elements contain
   solder paste (or soldermask for that matter) information.  How do
   people handle this?
   Thanks,
   --
   Scott Post
   [1]scott.e.post@xxxxxxxxx

References

   1. mailto:scott.e.post@xxxxxxxxx


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