gEDA-user: PCB thermal width

[Duncan Drennan <duncan.drennan@xxxxxxxxx>]

In the PCB manual it says,

"Thermal [Scale]
 	
Scale Relative size of thermal fingers. A value of 1.0 makes the
finger width twice
the annulus width (copper diameter minus drill diameter). The normal value
is 0.5."

So theoretically making the annulus larger (with "s") should make the
thermal spoke width larger, but when you do this the thermal width
stays constant. Has this definition changed? How is the thermal width
currently calculated?

Thanks,
Duncan

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