Re: gEDA-user: solderpaste on pads for BGAs

[Rick Collins <gnuarm.2006@xxxxxxxxx>]

Specifically, the solder balls on the part are to provide some space 
between the part and the board.  The solder paste is as large as the 
pad and makes sure the full pad is wet with solder and completes the 
connection.

Rick


At 04:23 AM 11/18/2010, you wrote:
> Hi all,
>
>
> I'd like to ask if solder-paste is necessary for BGAs. The BGA already has
> some tin, so the solder-paste on the pad wold be a bad idea.
>
> Do I miss something?
>
> Thanks,
> Levente
>
> --
> Kovacs Levente <leventelist@xxxxxxxxx>
> Voice: +36705071002
>
>
>
>
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