[Author Prev][Author Next][Thread Prev][Thread Next][Author Index][Thread Index]
Re: gEDA-user: pcb, howto partition power planes?
On Tue, Oct 28, 2008 at 02:49:37PM -0400, DJ Delorie wrote:
>
> > In my 20+ years in engineering I have yet to see one case where
> > splitting a ground plane under high-speed ADCs has worked.
>
> What about high precision ADCs? I'm working on a design using ADE7753
> power monitor chips (16-bit ADCs) , and their own app note (AN564)
> shows a ferrite isolating analog ground, and a 10R resistor isolating
> AVdd.
In my 30+ years in engineering, I see much more trouble caused by
splitting ground planes than solved by them.
App notes and example designs are special cases: there is only
one chip straddling the analog and digital divide. If you have
more than one (e.g., both an ADC and a DAC) all those ideas
pretty much go out the window, and you're better off with a
single ground plane.
I have seen exactly one case where a "split" (very carefully done)
on the ground plane was needed to avoid a source of ground return
crosstalk.
- Larry
_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user