Re: gEDA-user: oblong via pads

["John Luciani" <jluciani@xxxxxxxxx>]

On Fri, Sep 26, 2008 at 2:30 PM, Dave N6NZ <n6nz@xxxxxxxx> wrote:

> I'm working on a design for the local robot club where I want to make
> the board as "newbie friendly" as possible in every way.  This includes
> making it approachable to those that may be timid about soldering. So I
> made easy-solder footprints by putting a whonking-big oblong pad on the
> solder side of the footprint, and left the normal annulus on the
> component side.  This kills less routing capacity on the component side.

For  DIP packages I have been using a 40mil x 90mil overlay on both
sides of the boards. I have found these very easy to solder. For 100mil
center DIPs there is 40mils of space between pads.

(* jcl *)

-- 
http://www.luciani.org


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