Re: gEDA-user: oblong via pads

[Dave N6NZ <n6nz@xxxxxxxx>]

John Luciani wrote:
> On Fri, Sep 26, 2008 at 2:30 PM, Dave N6NZ <n6nz@xxxxxxxx> wrote:
> 
>> I'm working on a design for the local robot club where I want to make
>> the board as "newbie friendly" as possible in every way.  This includes
>> making it approachable to those that may be timid about soldering. So I
>> made easy-solder footprints by putting a whonking-big oblong pad on the
>> solder side of the footprint, and left the normal annulus on the
>> component side.  This kills less routing capacity on the component side.
> 
> For  DIP packages I have been using a 40mil x 90mil overlay on both
> sides of the boards. I have found these very easy to solder. For 100mil
> center DIPs there is 40mils of space between pads.

If you are making your own boards with the toner transfer method and 
need to solder both sides, then having large pads on both sides makes 
sense.  But for plated-through holes, I can't see using the space on the 
component side.

My pads are also asymmetrical. Only one side is fat.

-dave

> 
> (* jcl *)
> 



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