Re: gEDA-user: Blind and buried vias?

[msokolov@xxxxxxxxxxxxxxx (Michael Sokolov)]

Bill Gatliff <bgat@xxxxxxxxxxxxxxx> wrote:

> The latest generation of BGA parts have so many pins on the package, 
> packed so tightly together, that it isn't possible to get all the 
> signals out of the chip in two layers and still have the traces large 
> enough to meet specs.
> [...]
> I'm told that the OMAP3430's Package-on-Package configuration 
> requires at least six layers to get all the signals out.  Ugh.

OK, that explains the need for a lot of layers.  But how does the need
for blind/buried vias arise?

MS


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