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gEDA-user: new footprint guidelines
Yes, the old library parts are pre-hires and the pads can be "way off"
and should be fixed. Thanks!
If we're hand-coding footprints, we could use "0.5mm" instead of
"1965" and preserve the *meaning* of the units. We lose some
compatibility with older PCBs, but if the purpose is to update the
current distribution that shouldn't be a problem.
We should probably go with build-time generated footprint files,
rather than continue to use the m4 runtime generation. That allows us
to use more than just m4, too. Makefile rules for standard %.whatever
to %.fp conversions...
My general rules:
Mask should be 3 mil away from copper, and slivers should be at least
6 mil wide. That means, if there's less than 12 mil between pads you
go with a gang-opening.
Silk should not overlap the *mask opening* and should be 3 mil away at
least. 5 mil min silk lines.
Origin and license should be stored in element attributes, not file
comments, so they're copied into schematics.
It would probably be a good idea to have more than one design for each
footprint; one for reflow'd boards and one with longer pads for hand
soldering.
All QFN parts should have some visual aids to centering :-) On my last
board, I added four diagonal lines on the silk layer to align each
corner (like a big X), that worked out well.
Refdes should be properly placed and sized but I'm not sure what's
best. For example, on every single RESC1608N part I place I have to
make the refdes smaller and move it off the pads. Getting size right
is far more important than position; it's easy (and often needed
anyway) to move things around in only-text mode.
Exposed pads should have a proper solder paste pattern on them too.
This usually means the one pad is made up of multiple pads, some with
"nopaste". I use one big "nopaste" pad and a small paste pad for each
paste dot I want.
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