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Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

   Be careful mounting a part like this upside down.  If the back side
   pad on the part is critical to grounding or heat removal (like some
   switching power supply controllers) you could easily cause the part to
   malfunction or worse yet, fail altogether.
   Joe T

   On Tue, Apr 28, 2009 at 12:15 PM, William Estrada
   <[1]MrUmunhum@xxxxxxxxxxx> wrote:

     Use a plcc adapter. Or use the dead bug design, glue it upside down
     to a piece of plastic then solder the wires to the chip.
     > Message: 11
     > Date: Mon, 27 Apr 2009 22:55:17 -0500
     > From: Bill Gatliff <[2]bgat@xxxxxxxxxxxxxxx>
     > Subject: gEDA-user: OT: soldering QFN packages with exposed
     bottom
     >     pad?
     > To: gEDA user mailing list <[3]geda-user@xxxxxxxxxxxxxx>
     > Message-ID: <[4]49F67E25.1010308@xxxxxxxxxxxxxxx>
     > Content-Type: text/plain; charset=ISO-8859-1; format=flowed

   >
   > Guys:
   >
   > Got any recommendations for how to hand-solder a QFN package that
   has an
   > exposed bottom pad?  At the moment, all I have is a soldering iron.
   >
   > Do you think I could just put a plated-through via underneath the
   pad,
   > and then flow solder through that from the back side?
   >
   >

   > b.g.
   >
   > -- Bill Gatliff [5]bgat@xxxxxxxxxxxxxxx

     --
     William Estrada
     [6]MrUmunhum@xxxxxxxxxxx
     Mt-Umunhum-Wireless.net ( [7]http://64.124.13.3 )
     Ymessenger: MrUmunhum

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References

   1. mailto:MrUmunhum@xxxxxxxxxxx
   2. mailto:bgat@xxxxxxxxxxxxxxx
   3. mailto:geda-user@xxxxxxxxxxxxxx
   4. mailto:49F67E25.1010308@xxxxxxxxxxxxxxx
   5. mailto:bgat@xxxxxxxxxxxxxxx
   6. mailto:MrUmunhum@xxxxxxxxxxx
   7. http://64.124.13.3/
   8. mailto:geda-user@xxxxxxxxxxxxxx
   9. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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