Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

[William Estrada <MrUmunhum@xxxxxxxxxxx>]

Use a plcc adapter. Or use the dead bug design, glue it upside down
to a piece of plastic then solder the wires to the chip.

> Message: 11
> Date: Mon, 27 Apr 2009 22:55:17 -0500
> From: Bill Gatliff <bgat@xxxxxxxxxxxxxxx>
> Subject: gEDA-user: OT: soldering QFN packages with exposed bottom
>     pad?
> To: gEDA user mailing list <geda-user@xxxxxxxxxxxxxx>
> Message-ID: <49F67E25.1010308@xxxxxxxxxxxxxxx>
> Content-Type: text/plain; charset=ISO-8859-1; format=flowed
>
> Guys:
>
> Got any recommendations for how to hand-solder a QFN package that has an
> exposed bottom pad?  At the moment, all I have is a soldering iron.
>
> Do you think I could just put a plated-through via underneath the pad,
> and then flow solder through that from the back side?
>
>
> b.g.
>
> -- Bill Gatliff bgat@xxxxxxxxxxxxxxx

-- 
William Estrada
MrUmunhum@xxxxxxxxxxx
Mt-Umunhum-Wireless.net ( http://64.124.13.3 )
Ymessenger: MrUmunhum




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