Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

[William Estrada <MrUmunhum@xxxxxxxxxxx>]

Joe,

  I would think that mounting the chip upside down would allow better
heat distribution?? I could be wrong. You may need a heat sink?

joe tarantino wrote:
> Be careful mounting a part like this upside down.  If the back side 
> pad on the part is critical to grounding or heat removal (like some 
> switching power supply controllers) you could easily cause the part to 
> malfunction or worse yet, fail altogether.
>
> Joe T
>
> On Tue, Apr 28, 2009 at 12:15 PM, William Estrada 
> <MrUmunhum@xxxxxxxxxxx <mailto:MrUmunhum@xxxxxxxxxxx>> wrote:
>
>     Use a plcc adapter. Or use the dead bug design, glue it upside down
>     to a piece of plastic then solder the wires to the chip.
>
>


-- 
William Estrada
MrUmunhum@xxxxxxxxxxx
Mt-Umunhum-Wireless.net ( http://64.124.13.3 )
Ymessenger: MrUmunhum




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