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Re: gEDA-user: QFP footprint naming conventions

To: geda-user@seul.org
Subject: Re: gEDA-user: *QFP* footprint naming conventions
From: Bob Paddock <bpaddock@csonline.net>
Date: Thu, 28 Aug 2003 05:40:45 -0400
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> > But what about VQFP ?

Here is one that explains some of the newer ones like QFN.
Has some good tips on soldering and solder masks:

http://focus.ti.com/docs/apps/catalog/resources/appnoteabstract.jhtml?abstractName=slua271

Download .pdf (slua271.pdf, 166 Kbytes) (Requires Acrobat Reader 4.x)

QFN/SON PCB Attachment Application Note

Quad flatpack--no leads (QFN) and small outline--no leads (SON) are 
leadless packages with electrical connections made via lands on the bottom 
side of the component to the surface of the connecting substrate (PCB, 
ceramic). This application note presents users with introductory 
information about attaching QFN/SON devices to printed-circuit boards.


-- 
             http://www.softwaresafety.net/
      http://www.unusualresearch.com/ http://www.bpaddock.com/

References:
- Re: gEDA-user: *QFP* footprint naming conventions
  - From: Dave McGuire <mcguire@neurotica.com>

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