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Re: gEDA-user: pads, mask and solder paste



Kai-Martin Knaak wrote:
The solder paste pattern emitted by PCB seems to coincide exactly with
the copper of the pads. This is a reasonable default. But there are use
cases where a different solder paste size is better.

1) A pad completely covered with solder mask should not receive any
solder paste. This kind of pads are useful a way to achieve tracks
in footprints.
Add the "nopaste" flag

2) Pads partly covered by solder mask should receive a solder mask
pillow that corresponds to the hole in the mask, rather than to the
pads copper dimensions. Such partly covered pads are useful as a heat
sink.
My way is to make the main pad "nopaste" and add smaller pads within the bigger pad.

And my own question to add: is there a way to shrink all solder paste openings, say, 5%?

Cory


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