gEDA-user: pads, mask and solder paste

[Kai-Martin Knaak <kmk@xxxxxxxxxxxx>]

Hi.
The solder paste pattern emitted by PCB seems to coincide exactly with 
the copper of the pads. This is a reasonable default. But there are use 
cases where a different solder paste size is better. 

1) A pad completely covered with solder mask should not receive any
solder paste. This kind of pads are useful a way to achieve tracks
in footprints.

2) Pads partly covered by solder mask should receive a solder mask 
pillow that corresponds to the hole in the mask, rather than to the 
pads copper dimensions. Such partly covered pads are useful as a heat
sink.

3) If large and small sized SMD parts are combined on the same board, 
it may be desirable to reduce the size of the solder paste pillows 
for the smaller footprints. 

Is there a way to achieve these goals?

---<)kaimartin(>---
-- 
Kai-Martin Knaak
Email: kmk@xxxxxxxxxxxxxxx
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