Stephen Ecob wrote: >> 1) A pad completely covered with solder mask should not receive any >> solder paste. This kind of pads are useful a way to achieve tracks >> in footprints. > > I've tried to do this - see the attached footprint ResCu250mOhm-fab.fp > This doesn't quite work. In the GTK hid the solder mask is rendered > as a very thin line. ack. > The gerbers contain the solder mask opening as a > line of width 0, iirc. Not with the pcb versions I have installed here. (20100929, git head and Peter Cliftons GL enabled version) These emit an error on stdout and omit the zero sized aperture in the *_frontmask.gbr . >> 2) Pads partly covered by solder mask should receive a solder mask >> pillow that corresponds to the hole in the mask, rather than to the >> pads copper dimensions. Such partly covered pads are useful as a heat >> sink. > > Yes, that works fine - see S005.fp. This is for a SMD bridge and > works exactly as you've described. Yes, the solder mask is smaller than the copper of the pad. But no, if I render the gerbers, the solder paste is still as large as the copper. See attachment. If the stencil would be fabricated from these files without modification, there would be solder paste printed on top of solder mask. ---<)kaimartin(>--- -- Kai-Martin Knaak Email: kmk@xxxxxxxxxxxxxxx Ãffentlicher PGP-SchlÃssel: http://pool.sks-keyservers.net:11371/pks/lookup?search=0x6C0B9F53
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S005_gerbers.zip
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