Re: gEDA-user: pads, mask and solder paste

[Stephen Ecob <silicon.on.inspiration@xxxxxxxxx>]

On Mon, Feb 14, 2011 at 8:08 AM, Kai-Martin Knaak <kmk@xxxxxxxxxxxx> wrote:

>>> 2) Pads partly covered by solder mask should receive a solder mask
>>> pillow that corresponds to the hole in the mask, rather than to the
>>> pads copper dimensions. Such partly covered pads are useful as a heat
>>> sink.

This patch against GIT head does what you describe:

--- a/src/draw.c
+++ b/src/draw.c
@@ -544,7 +544,10 @@ DrawEverything (BoxTypePtr drawn_area)
                || (!TEST_FLAG (ONSOLDERFLAG, pad)
                    && side == COMPONENT_LAYER))
              if (!TEST_FLAG (NOPASTEFLAG, pad))
-               DrawPadLowLevel (Output.fgGC, pad, false, false);
+               if (pad->Mask < pad->Thickness)
+                 DrawPadLowLevel (Output.fgGC, pad, true, true);
+               else
+                 DrawPadLowLevel (Output.fgGC, pad, false, false);
          }
          ENDALL_LOOP;
        }

I've only given this a quick test, it works for the S005.fp mentioned before.
I'd appreciate it if other could check the patch to see if it causes
problems in other areas.
Limiting the paste size to min(Mask, Thickness) seems like a good
idea, but can anyone think of a case where you'd actually want the
paste opening to be larger than the solder mask opening ?
Stephen


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