On Mon, Feb 14, 2011 at 6:27 AM, Kai-Martin Knaak <kmk@xxxxxxxxxxxx> wrote: > Hi. > The solder paste pattern emitted by PCB seems to coincide exactly with > the copper of the pads. This is a reasonable default. But there are use > cases where a different solder paste size is better. > > 1) A pad completely covered with solder mask should not receive any > solder paste. This kind of pads are useful a way to achieve tracks > in footprints. I've tried to do this - see the attached footprint ResCu250mOhm-fab.fp This doesn't quite work. In the GTK hid the solder mask is rendered as a very thin line. The gerbers contain the solder mask opening as a line of width 0, iirc. When I had this PCB fabricated the fab house got confused and changed the width of the solder mask opening to be the same as the track width! Next time I send out to fab, I'll hack the gerbers in an editor to totally nuke the undesired solder mask opening paths. > 2) Pads partly covered by solder mask should receive a solder mask > pillow that corresponds to the hole in the mask, rather than to the > pads copper dimensions. Such partly covered pads are useful as a heat > sink. Yes, that works fine - see S005.fp. This is for a SMD bridge and works exactly as you've described. > Is there a way to achieve these goals? 1.5 out of 3 is a start :-)
Attachment:
ResCu250mOhm-fab.fp
Description: application/pcb-footprint
Attachment:
S005.fp
Description: application/pcb-footprint
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