I am very pleased to see how much intelligent discussion my little
comments have sparked. This is a very educational thread.
Hopefully I'm not putting words in Stuarts mouth, but we're really
talking about 2 different things in this thread. Some of the comments
here are related to testing a bare board (no components soldered down
yet). In that case, the component pads are probably sufficient.
The 2nd case, which I think is the one Stuart was initially asking
about, is for automated testing of a board which has been already
assembled. In that case, you really do want test pads on all the nodes
and preferably on one side of the board. We used to do that at a place
I worked and it was pretty cool. They'd stick a fully assembled
analog/mixed signal board into the tester and catch nearly all of the
boards with manufacturing (placement/soldering) defects.
Thanks, Dan. I am indeed talking about testing fully assembled
boards, not raw PCBs. That's why probing the component pads isn't
possible or applicable.
Stuart