Re: gEDA-user: Thermals on Pads

[asomers@xxxxxxxxx]

The IPC-2222 table of contents shows that "Thermal Relief in Conductor
Planes" gets only one tenth of a page.  I can't imagine any detailed
information in that space.  It's sister document, IPC-2221, can be
found for free at
http://www.victronics.cl/Inf_tecnica/Notas%20de%20aplicacion/PCBs/IPC-2221(L).pdf
.  IPC-2221 has a section on thermal relief, but without any useful
details.

On Sun, Jan 30, 2011 at 2:20 PM, Peter Clifton <pcjc2@xxxxxxxxx> wrote:
> On Sun, 2011-01-30 at 20:39 +0000, Peter Clifton wrote:
>> I've been looking at some brokenness with our normal thermal shape
>> generation recently, so if I get a chance I could look at your patch -
>> and possibly work from it.
>
> The only reference to geometry I've found so far is:
>
> http://www.pcbwizards.com/Glossary20.htm
>
> And IPC-2222. (Which I don't have a copy of).
>
> Anyone have access to a copy?
>
> --
> Peter Clifton
>
> Electrical Engineering Division,
> Engineering Department,
> University of Cambridge,
> 9, JJ Thomson Avenue,
> Cambridge
> CB3 0FA
>
> Tel: +44 (0)7729 980173 - (No signal in the lab!)
> Tel: +44 (0)1223 748328 - (Shared lab phone, ask for me)
>
>
>
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>


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