Re: gEDA-user: Another board with gEDA/PCB

[Darrell Harmon <mail@xxxxxxxxxxxx>]

Stephen Meier wrote:

> I am interested too in how you alligned the bga to the pcb. One 
> problem with high density components is that they were at 1 mm 
> pitch... no 8 mill pitch flip chips... no 6 mill pitch flip chips...


Chip resistors (0805) and super glue to keep the thing lined up going 
into the oven.  I used the silkscreen as a guide.  I gave it about 0.3mm 
to move and surface tension centered it perfectly.  Alignment is not 
nearly as critical as soldering a LQFP176 or PQFP208.  I did not use 
solderpaste, just lots of flux.

> Still if you did the alignement and then had a reasonable yeild (>50%) 
> then I take my hat off to you. My point has been that these tools are 
> capable of professional (whatever that meens) capabilities.
>
> Again, Darrell... I do congradulate anyone who can build boards with 
> high density components in less then ideal conditions.
>
> Taking a bow,
>
> Steve Meier
The tools are great.  I just about laugh when I get yet another one of 
those Protel brochures telling me it is on sale for $7999.  I have not 
run into any limitation of gEDA or PCB yet that I could not work around.

--

Darrell Harmon
100x100mm SBC running GNU/Linux:
http://dlharmon.com/sbc.html