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gEDA-user: Mechanical footprints on pcb



Hi,

How do I include heat sinks into the pcb layout. I have a schematic (in 
gschem) that needs heat sinks on 2 components. One a TO220 and one a GBJ 
case. I am developing the footprint  for the GBJ case but the process is 
complicated by the fact that the component can either be mounted 
vertically or bent over flat (hole through part). The bent over flat 
would seem to be the hardest because the heat sink and the component 
will be superimposed on the board layout.

Thank you in advance for any help. You guys are really responsive.

Gary L. Roach


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