Hi,
How do I include heat sinks into the pcb layout. I have a schematic (in
gschem) that needs heat sinks on 2 components. One a TO220 and one a GBJ
case. I am developing the footprint for the GBJ case but the process is
complicated by the fact that the component can either be mounted
vertically or bent over flat (hole through part). The bent over flat
would seem to be the hardest because the heat sink and the component
will be superimposed on the board layout.
Thank you in advance for any help. You guys are really responsive.
Gary L. Roach
_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
_______________________________________________ geda-user mailing list geda-user@xxxxxxxxxxxxxx http://www.seul.org/cgi-bin/mailman/listinfo/geda-user