Re: gEDA-user: Using SMT

["Robert Butts" <r.butts2@xxxxxxxxx>]

Thanks everyone.

 

The Project:

I'm a quadriplegic and during the summer I have difficulty regulating my temperature and am usually restricted to indoors and air condition when the outdoor temperature exceeds 80 degrees.  I've been working on a design to mount a thermoelectric cold plate in the backrest of my wheelchair.  This cold plate will have the capability of cooling or heating via a PWM controlling an h-bridge.  I'm using a microchip dsPIC DSC to monitor thermocouples in the backrest, interface to the user and control the power to the cold-plate.  I'm about 80% done with the code and trying to get my spare chair prototyped while the summer is still here (central Massachusetts).

On Tue, Jun 24, 2008 at 1:29 PM, John Luciani <jluciani@xxxxxxxxx> wrote:

On Tue, Jun 24, 2008 at 1:12 PM, Robert Butts <r.butts2@xxxxxxxxx> wrote:

I'm about to start bread boarding a desin.  I have a few surface mount chips that I got SMT-to-DIP adapters for.  I also purchased SMT paste.  I have never worked with surface mount devices.  How do you paste the chip to its footprint?  How do you get the excess, if any, paste out?  I have a feeling it's got something to do with heating it.

Thanks,

Rob

I use wire solder, water soluble flux and a fine tip soldering iron. A list of the tools
and supplies I use are at  http://tinyurl.com/6b2vy9

(* jcl *)

--
http://www.luciani.org


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