Re: gEDA-user: [pcb] overlapping pin/pad -- won't form thermal

[Dave N6NZ <n6nz@xxxxxxxx>]

DJ Delorie wrote:
>> PCB needs first class support for oblong through-holes.
> 
> Yup.  I've talked about a "multi-pin" before; this is a pin with
> arbitrary shaped copper/soldermask/etc on each layer.
>
Yes, when you get to multi layer boards you often want a different 
annulus on inner layers.

I think it's time to think about an expansion to the footprint grammar 
to support more sophisticated pins and also more sophisticated paste specs.

-dave


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