Re: gEDA-user: [pcb] overlapping pin/pad -- won't form thermal

[Peter Clifton <pcjc2@xxxxxxxxx>]

On Mon, 2008-03-10 at 16:16 -0800, Dave N6NZ wrote:
> DJ Delorie wrote:
> >> PCB needs first class support for oblong through-holes.
> > 
> > Yup.  I've talked about a "multi-pin" before; this is a pin with
> > arbitrary shaped copper/soldermask/etc on each layer.
> >
> Yes, when you get to multi layer boards you often want a different 
> annulus on inner layers.

> I think it's time to think about an expansion to the footprint grammar 
> to support more sophisticated pins and also more sophisticated paste specs.

I want it on 2-layer boards too, but this is a different case...

I've got power terminals which want 5mm clearance to a ground plane, but
I don't really want a thermal with its tendrils extending that far out.


-- 
Peter Clifton

Electrical Engineering Division,
Engineering Department,
University of Cambridge,
9, JJ Thomson Avenue,
Cambridge
CB3 0FA

Tel: +44 (0)7729 980173 - (No signal in the lab!)



_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user