Re: gEDA-user: Mixed signal plane tie-in

[epswint <epswint@xxxxxxxxxxx>]

Thanks for the link - I've looked at that page before, but I just 
thought I'd test if someone had an experience which clearly favored one 
over the other.

-Ethan

Eric Brombaugh wrote:
> epswint wrote:
>> Now, the question:  I've observed two different techniques for tying 
>> analog and digital ground planes on mixed-signal boards.  The first 
>> technique placed the tie-in directly under the analog/digital converter 
>> on the MCU, the second technique placed the tie-in at the far edge of 
>> the board between the analog and digital connectors.  Both boards were 
>> MCU development boards, laid out so that roughly one quadrant of the 
>> board was analog, the rest digital.  I've got all of my components 
>> placed and ready to go, just wondering what experience/thoughts the 
>> user-list had on the subject.
>>     
> That's a $64,000 question. Both ways will work if handled carefully, and 
> which one you use depends on your previous experience and the design 
> requirements.
>
> Analog Devices has a pretty good tutorial on this:
>
> http://www.analog.com/en/content/0,2886,761%255F795%255F97529%255F0,00.html
>
>
> Eric
>   


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