Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

[Dan McMahill <dan@xxxxxxxxxxxx>]

DJ Delorie wrote:
>>   I would think that mounting the chip upside down would allow
>> better heat distribution?? I could be wrong. You may need a heat
>> sink?
> 
> The whole point of the bottom pad is to get heat out of the chip;
> there are expectations like having copper and vias under the pad to
> get the heat to the opposite side of the pcb where it can be
> dissipated.

as one who has put die in exposed paddle QFN's... the heat dissipation 
is a big deal but so is the electrical grounding with as low inductance 
as possible.

-Dan



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