Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

[John Griessen <john@xxxxxxxxxxxxxx>]

Bob Paddock wrote:

> Our CM got a ten minute rant from one of the Big Name Solder
> Vendors when they were asked that question.  After ten minutes
> our CM knew all of the evils of QFN packages, such as being
> almost impossible to clean under (don't use QFN packages in
> high impedance circuits, which is giving us fits right now,
> due to poor cleaning), but still the Big Name Solder Vendor did not answer
> the question as to what *should* be used.

So BGA packages wash out underneath effectively?

John
-- 
Ecosensory   Austin TX


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