Re: gEDA-user: Enlarged footprints for hand soldering -- name conventions

[Bert Timmerman <bert.timmerman@xxxxxxxxx>]

Hi all,

I have the notion that according to the IPC the abbreviation (or general
suffix) _HS should stand for Heat Sink requiring additional holes or
pads.

Kind regards,

Bert Timmerman.

On Tue, 2007-11-20 at 16:18 -0500, Steven Michalske wrote:
> When i have made hand soldering pads for QFP with the center pad I
> used the HS for hand solder, because it is not truly the M for maximum
>  and would conflict with a  true JEDEC M
> 
> my QFP with pad hand solder has a pin placed in the center of the pad
> to allow for applying heat through the via and to solder the back of
> the part.
> 
> Steve
> 
> On Nov 20, 2007 1:51 PM, Stefan Salewski <mail@xxxxxxxxxxxx> wrote:
> > Hello,
> >
> > some footprint outlines suggested by manufactures are only useful for
> > automatic hot air soldering (ie. DFN14 of LTC4088 from Linear).
> >
> > For hand soldering extended pads are necessary -- so I will create two
> > versions.
> >
> > How should I name the official (manufacturer) and the extended
> > footprints?
> >
> > PartName.fp (size as spezified in datasheet)
> > PartName_ext.fp (extended)
> > PartName_ext10.fp (each pad extended by 10mil)
> > PartName_hs.fp (hand soldering)
> >
> > ?
> >
> > Best regards
> >
> > Stefan Salewski
> >
> >
> >
> >
> >
> >
> > _______________________________________________
> > geda-user mailing list
> > geda-user@xxxxxxxxxxxxxx
> > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
> >
> 
> 
> _______________________________________________
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> geda-user@xxxxxxxxxxxxxx
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