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Re: gEDA-user: bending design rules for TSSOP20 -- need advice



That's interesting information, thanks.

I'm thinking I misintrepreted "mask swell" to mean .008 copper-to-mask, as opposed to mask diamater = pad diameter + 0.008, which would yield .004 mask-to-copper. If so, then I end up with .008 of mask between pads. In any case, I need to verify with them exactly what the rule means.

-dave


Steve Meier wrote:
One shop I work with asks for soldermasks to be at least 5 mills wide.
If you have two adjacent pads with solder mask between the pads that
soldermask should be at least 5 mills wide. So I suspect for PCBexpress
that they need the soldermask to be at least 8mills wide. The issues has
to do with alignment tolerences. Soldermask put on with a stencil  has
worse tolerences the soldermask applied with a photo imagable process.

Steve Meier

Dave N6NZ wrote:
Here is the rule in question from PCBexpress web site:

Solder mask swell is at least .008 larger than copper surfaces to keep
mask off pads.

Am I interpreting that correctly?  That I need .008 all around the
copper pad?  Or is a mask .008 wider than the pad sufficient?

-dave

Dave N6NZ wrote:
Thought I just saw a thread on this topic, but I deleted the whole
works and can't find it in the archives.

I'm trying to reconcile a data sheet for a TSSOP-20, 0.65mm lead
pitch package with PCBexpress's design rules.  The problem: 26mil
l.p. and 10mil pad width leaves 16mil btw pads.  The rule: "8mil
between mask and copper" leaves exactly 0 mils of mask between pins.

So.... can I bend something here and get a reasonable board? Something like: go to an 8mil pad width so that I get 2mil of mask in
between. Pad is too skinny, but I guessing should reflow well...
those of you with more experience than me at SMT need to clue me up. Will 2mil of mask be too skinny to work well? Other option: live with
no mask between pins and hope I don't bridge.


Thoughts?

-dave


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