Re: gEDA-user: BGA package prototyping

[Bert Timmerman <bert.timmerman@xxxxxxxxx>]

Hi all,

Was this revolutionary technology introduced on, or around, April 1st ?

And some weeks later withdrawn ??

That doesn't sound odd to me  ;-)

Kind regards,

Bert Timmerman.

On Sat, 2007-10-20 at 06:40 -0400, Bob Paddock wrote:
> On Thursday 18 October 2007 08:39:00 pm Steve Meier wrote:
> 
> > Via in pad is possible with PCB, micro-vias arn't yet. To avoid the
> > wicking or chimeny effect have the back of the board coated with an
> > epoxy material prior to assembly this prevents the heat from shooting up
> > the via and then sucking the solder down.
> 
> Not directly related to solving that problem but this came to mind:
> 
> "The Bleeding Edge: Inventing the 'VSHDIHTLCTEHF' Microcircuit"
> 
> "Sierra Micro Electronics has just completed six months of R&D on an exciting 
> new technology: a Very Small, HDI, High-Thermal, Low CTE, High-Frequency 
> (VSHDIHTLCTEHF) microcircuit."
> 
> However it has been removed from pcb007's archives.  Odd.
> 
> It is still in the Google Cache if you do a search for 
> "VSHDIHTLCTEHF", via Google.
> 
> "We invented ZIG ZAG microvias to enable the position of the through-holes in 
> the core to be moved around from the original fixed BGA pitch on the top 
> layer to increase spacing. ZIG ZAG microvias allow each layer of stacked 
> microvias to move a bit sideways. Over four layers you can move a microvia 
> about 5–7 mils sideways, which is enough to move the core drill position to 
> create a thicker web between drill locations on the core."
> 
> 
> 
> 



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