Re: gEDA-user: PCB burn in spec?

["Ellec, Chris" <Chris.Ellec@xxxxxxxxxxxxxxxxxxxx>]

We want to do powered burn in of populated boards, to catch bad solders
and early component failures. I'm thinking 0-65C.

Chris.
 
> Message: 5
> Date: Thu, 15 Oct 2009 19:50:13 -0400
> From: Bob Paddock <bob.paddock@xxxxxxxxx>
> Subject: Re: gEDA-user: PCB burn in spec?
> To: gEDA user mailing list <geda-user@xxxxxxxxxxxxxx>
> Message-ID:
> 	<bf689bbe0910151650w59047f44t54896d7fb6f01684@xxxxxxxxxxxxxx>
> Content-Type: text/plain; charset=ISO-8859-1
> 
> On Wed, Oct 14, 2009 at 3:05 PM, Ellec, Chris
> <Chris.Ellec@xxxxxxxxxxxxxxxxxxxx> wrote:
> >
> > Can somebody recommends burn in spec. for PCB such as time vs.
> > temperature? Is there a mil spec for that? I could only 
> find mil-spec
> > for burning in individual IC, not PCB (mil-std-883 for example).
> 
> Unpopulated boards?
> 
> Populated boards with or without power while being burned in?
> 
> What is the actual goal you want by doing burn in?
> 
> What we did for populated, unpowered, boards was 65'C for 24 hours,
> then into a -20'F freezer for 24 hours, for four cycles of 
> that, when we
> wanted to thermal cycle solder joints.  Don't know if there was spec,
> it was what someone came up with at the CM I worked.
> 
> 
> 


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